EngeniusMicro Selected for Additive Manufacturing Phase II SBIR Award
EngeniusMicro has been selected for award of a $1M contract from the Missile Defense Agency (MDA). This Phase II SBIR effort will use additive manufacturing technology to 3D print electronic packages around bare semiconductor die. Custom, on-demand printing of packages for semiconductor die will reduce the potential for counterfeiting that may occur in untrusted vendors. […]
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