EngeniusMicro delivers engineered solutions at the intersection of electronics, manufacturing, and microscale technology. Our capabilities span the full path from design through finished hardware—developed for customers whose applications leave no room for compromise.

Applied Electronics

From RF design to printed electronics, we develop electronic solutions built for the environments our customers operate in. Our work spans design, fabrication, and integration of hardware for defense, energy, and space applications.

• RF technologies, including antenna design and fabrication
• Printed electronics on a variety of substrates
• PCB fabrication and repair
• Electronics for high-temperature, cryogenic, and avionics applications

Advanced Manufacturing

Our additive and hybrid manufacturing systems bring precision fabrication capabilities to the benchtop. Combining multi-material 3D printing, CNC milling, and process automation, we produce functional hardware in materials conventional systems can’t handle.

• Multi-process additive manufacturing (EMU)
• Hybrid additive/subtractive fabrication with unified process automation (STORK)
• Multi-material printing: ceramics, high-temperature polymers, and conductive metals
• Micron-level precision with production-relevant build capacity

Microsystems

We design and build microscale devices and packaging that perform where conventional hardware falls short. From low-power wireless sensing to advanced packaging, our microsystems work supports condition-based maintenance and mission-critical monitoring.

• Low-power wireless microsensors for condition-based maintenance
• Multi-chip module (MCM) packaging for demanding environments
• MEMS design and fabrication
• Chip carriers and radiation-tolerant packaging solutions