MEMS & Microsystems
EngeniusMicro designs and packages microelectromechanical systems (MEMS) engineered to meet the extreme size, weight, power, and reliability demands of defense, energy, and space platforms. Our microfabrication expertise spans compact sensor and vacuum packaging solutions that support the next generation of precision instrumentation – from inertial sensors to advanced timing and measurement systems where every cubic centimeter and milliwatt matters. By combining deep materials science with proven multi-chip module (MCM) packaging techniques, we deliver microsystems built to perform in the demanding environments our customers operate in.
key features
- Compact sensor packaging — Miniaturized MEMS solutions designed to meet strict size, weight, and power (SWaP) constraints for platform integration
- Precision vacuum and pumping technologies — Microfabrication approaches supporting long-lifetime, high-performance sealed microsystems
- Materials-driven design — Advanced materials engineering to improve durability, thermal performance, and operational lifetime
- Multi-chip module integration — MCM packaging techniques applied to MEMS components for reliable, mission-relevant performance
- Support for precision instrumentation — Enabling technologies for inertial sensors, timing systems, and other high-precision defense and aerospace applications
Partners
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Whether you’re developing advanced sensors, RF technologies, or custom microelectronics, our engineering team is ready to help.