Our custom hybrid manufacturing machines — designed and built in-house — combine multiple processes in a single system, enabling rapid integration of polymer extrusion, pumped ink deposition, and subtractive processes to produce unique, high-performance results.
Packaged Electronics
EngeniusMicro addresses the unique demands of die-level ceramic component packaging for the aerospace microelectronics community. Our additive manufacturing capabilities enable intricate, highly precise ceramic packages that deliver exceptional thermal, electrical, and mechanical performance — at lower cost and in smaller production quantities than conventional packaging approaches allow.
Our additive processes give designers exceptional freedom and agility in ceramic package development. We work closely with each client to understand their specific requirements and deliver customized packages built to demanding specifications — with solutions for thermal management, hermetic sealing, and electrical insulation that provide robust protection and reliable performance in harsh operating environments.
Self-supporting printed wire bonds further extend design flexibility within printed package devices.
Applications
- Printed electronics
- Printed packages
- Multi-material additive manufacturing
- Multi-process additive manufacturing
- Custom die packaging
- System-on-chip packaging
- Prototyping applications
- Device repair and modification
Partners
Ready to Build Your next innovation?
Whether you’re developing advanced sensors, RF technologies, or custom microelectronics, our engineering team is ready to help.