EMU — Multi-Process Additive Manufacturing
Developed under a U.S. Army Phase II SBIR effort, the EMU delivers precision additive manufacturing for applications that demand unique materials and exacting placement on a variety of substrates. Designed with printed electronics in mind, the system prints polymers, nano-particle ink suspensions, and high-temperature engineering filaments—matching the performance of industry-leading machines at a fraction of the cost. Every EMU is configurable to meet customer requirements, making it a fit for defense, aerospace, medical, and research applications where precision and repeatability aren’t optional.
- Micron-level precision. Direct write traces down to 50 microns wide and 10 microns tall, with X/Y and Z repeatability of 12.5 microns and micro-stepping resolution to 0.625 microns.
- Built for advanced materials. Water-cooled dual extrusion with hot end temperatures over 400°C supports high-performance filaments including PEEK, PEKK, ULTEM-class polymers, and carbon- and glass-fiber-filled variants—alongside dispensable inks, pastes, resins, and epoxies.
- Production-relevant capacity. A 250 x 250 x 250 mm build volume with heated build platform, sized for functional hardware—not just coupons.
- Configurable by design. Multi-process architecture adapts to your materials and workflow, from printed electronics to structural components.
Stork
The STORK is a desktop hybrid manufacturing system that combines multi-material 3D printing with CNC milling in a single tool—governed by unified machine code for fully automated, end-to-end fabrication. By printing dielectrics and metals together in a single job, the STORK produces functional electronic hardware that would otherwise require multiple machines, processes, and handoffs. From antennas and chip carriers to high-temperature and cryogenic applications, it puts true multi-process fabrication on the benchtop.
- Multi-material printing in a single job. Dielectrics and conductive metals deposited together—no re-fixturing, no process breaks.
- Dielectric materials. Alumina-silica ceramics rated for 900°C, high-temperature polymers rated for 500°C, UV-curable dielectric photopolymers, Rogers ceramics, and thermoplastic polymers.
- Conductive metals. Silver and copper printing, with nickel and gold post-processing available.
- Integrated CNC milling. Additive and subtractive steps run under unified machine code for hands-off process automation and precision finishing.
- Proven applications. Antennas, chip carriers, radiation hardening, PCB fabrication and repair, high-temperature and cryogenic environments, avionics, and MEMS.
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