Shock and Vibration Isolation
Miniaturized vibration isolation and shock damping
•Integrated within additively manufactured package
•Devices tested to 40killi-g shock loads
•Mitigated shock-induced performance shifts compared to traditional packaging
Radiation Hardening
•Tested with 252Cf source at 1 cm distance
•5 mm W lid on AM LTCC package attenuated dose to Si chip, package shown in inset
•40% attenuation of 1.5 MeV γ-rays